IC chip burning procedures and methods:


1, Firstly connect the recorder data line, and the corresponding IC socket into the burning seat; turn on the computer and burner power.

2. Run the burning software:  (different burning socket correspond to different burning software).

3, Select the IC brand: After the program start screen appears, click on the “Device” menu, call up the IC brand selection table, and then select the brand you want to burn IC corresponding, and then click “OK”;

4. Select the IC model: At this time, the IC model of the company where the IC to be burned will appear. Select the model of the IC and click “Run”. If you want to select the jumper, then follow the instruction in computer to set the jumper. After the setting, click “OK”. If there is no jumper in the burner block, it will enter the burning interface directly;

5, Import the software to be burnt: click on the menu “File”, select “Load File To Programmer Buffer”, then choose to burn software, click “Open”, then select “00”, click OK.

6, Check the software check code (Buffer Checksum): After the software is loaded, a four-digit check code appears after the Buffer Checksum. This code must indicate the check code of the Electronic Design Document Notice. The software to be burned is correct. If it is incorrect, it should immediately respond to relevant departments to solve.

7, Burning software: Click “Program” button, the IC to be burned into the IC seat, installed after burning the seat on the burn button. After the burning is completed, “OK” will be displayed if the burning is successful, “Error” is displayed in red if the burning is failed, and the indicator of each burning seat corresponding to the IC of the burning OK is bright, indicating that the burning of the IC is successful.

8. Make a burn mark, burn the OK IC with a sticker, and burn the failed one into the other burning seat and reburn it once. Make sure that the IC is damaged and put it in the defective product box and make a mark. 

(At Fast PCB Studio, we provide IC sourcing & IC burning services for different types of ICs. Contact us to get a quick quote for your IC & programming work)


 IC burning failure and Recovery steps:

1, Repeat steps 1~6 above;
2, After the burning interface appears, click the “Auto” button, use the mouse to select “Erase, Program, Verify” three options;
3, The ICs to be burnt is loaded into the IC sockets, and then press the burning button on the burning sockets. When the burning is completed, “OK” is displayed if the burning is successful, and “Error” is displayed in red if the burning is failed. 
4, The OK IC put on stickers, failed IC to re-insert other burning seats to re-burn one more time, to determine if the IC is damaged. Later the Failure ICs are to be  returned for testing.

IC Chip Burning Process Highlight:
1, Be careful when placing the IC to avoid damaging the IC and burning the seat.
2. The IC must not be placed on opposite way. The IC must be checked before removing the pins for short circuit. Otherwise, the IC may be damaged.
3, Burning personnel must be trained before going to the post. During burning, they must not use other computer programs.
4, such as bad phenomena immediately feedback relevant technicians to solve.

Sourced From Fast PCB Studio
www.ChinaPCBCopy.com

IC Chip Burning Procedures | Fast PCB Studio

IC Chip Burning Procedures

Published by Fast PCB Studio on

 IC chip burning procedures and methods:


1, Firstly connect the recorder data line, and the corresponding IC socket into the burning seat; turn on the computer and burner power.

2. Run the burning software:  (different burning socket correspond to different burning software).

3, Select the IC brand: After the program start screen appears, click on the “Device” menu, call up the IC brand selection table, and then select the brand you want to burn IC corresponding, and then click “OK”;

4. Select the IC model: At this time, the IC model of the company where the IC to be burned will appear. Select the model of the IC and click “Run”. If you want to select the jumper, then follow the instruction in computer to set the jumper. After the setting, click “OK”. If there is no jumper in the burner block, it will enter the burning interface directly;

5, Import the software to be burnt: click on the menu “File”, select “Load File To Programmer Buffer”, then choose to burn software, click “Open”, then select “00”, click OK.

6, Check the software check code (Buffer Checksum): After the software is loaded, a four-digit check code appears after the Buffer Checksum. This code must indicate the check code of the Electronic Design Document Notice. The software to be burned is correct. If it is incorrect, it should immediately respond to relevant departments to solve.

7, Burning software: Click “Program” button, the IC to be burned into the IC seat, installed after burning the seat on the burn button. After the burning is completed, “OK” will be displayed if the burning is successful, “Error” is displayed in red if the burning is failed, and the indicator of each burning seat corresponding to the IC of the burning OK is bright, indicating that the burning of the IC is successful.

8. Make a burn mark, burn the OK IC with a sticker, and burn the failed one into the other burning seat and reburn it once. Make sure that the IC is damaged and put it in the defective product box and make a mark. 

(At Fast PCB Studio, we provide IC sourcing & IC burning services for different types of ICs. Contact us to get a quick quote for your IC & programming work)


 IC burning failure and Recovery steps:

1, Repeat steps 1~6 above;
2, After the burning interface appears, click the “Auto” button, use the mouse to select “Erase, Program, Verify” three options;
3, The ICs to be burnt is loaded into the IC sockets, and then press the burning button on the burning sockets. When the burning is completed, “OK” is displayed if the burning is successful, and “Error” is displayed in red if the burning is failed. 
4, The OK IC put on stickers, failed IC to re-insert other burning seats to re-burn one more time, to determine if the IC is damaged. Later the Failure ICs are to be  returned for testing.

IC Chip Burning Process Highlight:
1, Be careful when placing the IC to avoid damaging the IC and burning the seat.
2. The IC must not be placed on opposite way. The IC must be checked before removing the pins for short circuit. Otherwise, the IC may be damaged.
3, Burning personnel must be trained before going to the post. During burning, they must not use other computer programs.
4, such as bad phenomena immediately feedback relevant technicians to solve.

Sourced From Fast PCB Studio
www.ChinaPCBCopy.com

Categories: IC Unlock

Back to top